The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
Jul. 11, 2008
Applicants:
Motoo Asai, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Takahiro Mori, Ibi-gun, JP;
Inventors:
Assignee:
Ibiden Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
A metal layeris sandwiched between insulating layersandso that required strength is maintained. Hence it follows that the thickness of a core substratecan be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openingswhich reach the metal layerin the insulating layersandis simply required. Therefore, small non-penetrating openingscan easily be formed by applying laser beams. Thus, through holeseach having a small diameter can be formed.