The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
Mar. 05, 2010
Tzyy-jang Tseng, Hsinchu, TW;
Chang-ming Lee, Taoyuan County, TW;
Wen-fang Liu, Taoyuan County, TW;
Cheng-po Yu, Taoyuan County, TW;
Tzyy-Jang Tseng, Hsinchu, TW;
Chang-Ming Lee, Taoyuan County, TW;
Wen-Fang Liu, Taoyuan County, TW;
Cheng-Po Yu, Taoyuan County, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A circuit structure including a circuit board, an insulating layer, a conductive via, a platable dielectric layer and a conductive pattern is provided. The insulating layer is disposed on the circuit board and covers a circuit layer of the circuit board. The conductive via passes through the insulating layer and connects the circuit layer and protrudes from a surface of the insulating layer. The platable dielectric layer having a trench pattern is disposed on the surface of the insulating layer wherein the portion of the conductive via protruding from the surface is located in the trench pattern. The material of the platable dielectric layer includes a chemical platable material. The conductive pattern is in the trench pattern and connects the conductive via wherein an interface exists between the conductive pattern and the conductive via and protrudes from the surface of the insulating layer.