The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8286119 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 09, 2012

Filed:

Nov. 12, 2009
Applicants:

Fu-chieh Hsu, Hsin-Chu, TW;

Louis Chao-chiuan Liu, Hsin-Chu, TW;

Lee-chung LU, Taipei, TW;

Yi-kan Cheng, Taipei, TW;

Inventors:

Fu-Chieh Hsu, Hsin-Chu, TW;

Louis Chao-Chiuan Liu, Hsin-Chu, TW;

Lee-Chung Lu, Taipei, TW;

Yi-Kan Cheng, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for integrated circuit design includes providing a layout of an integrated circuit; determining key parameters of the integrated circuit; determining target values of the key parameters; and performing a first shrinkage of the layout using a first shrink percentage to generate a shrunk layout. The shrunk layout is evaluated by generating values of the key parameters from the shrunk layout. A portion of the values of the key parameters failing to meet respective ones of the target values is found. Guidelines for tuning manufacturing processes of the shrunk layout are provided, so that the portion of the values of the key parameters can meet the respective ones of the target values.


Find Patent Forward Citations

Hsu, Fu-Chieh. (2012). Systematic method for variable layout shrink (U.S. Patent No. 8286119). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8286119

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