The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2012
Filed:
Aug. 18, 2006
Glenn Alers, Scotts Valley, CA (US);
Nerissa Draeger, Fremont, CA (US);
Michael Carolus, Milpitas, CA (US);
Julie Carolus, Legal Representative, Pasadena, TX (US);
Glenn Alers, Scotts Valley, CA (US);
Nerissa Draeger, Fremont, CA (US);
Michael Carolus, Milpitas, CA (US);
Julie Carolus, legal representative, Pasadena, TX (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
The present invention provides methods of selectively depositing refractory metal and metal nitride cap layers onto copper lines inlaid in a dielectric layer. The methods result in formation of a cap layer on the copper lines without significant formation on the surrounding dielectric material. The methods typically involve exposing the copper lines to a nitrogen-containing organo-metallic precursor and a reducing agent under conditions that the metal or metal nitride layer is selectively deposited. In a particular embodiment, an amino-containing tungsten precursor is used to deposit a tungsten nitride layer. Deposition methods such as CVD or ALD may be used.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile