The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8277619 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 02, 2012

Filed:

Jul. 06, 2011
Applicants:

Chung-liang Chang, Hsin-Chu, TW;

Shau-lin Shue, Hsinchu, TW;

Inventors:

Chung-Liang Chang, Hsin-Chu, TW;

Shau-Lin Shue, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25B 9/04 (2006.01); C25B 9/02 (2006.01); C25D 17/04 (2006.01); C25D 17/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electroplating apparatus for depositing a conductive material on a semiconductor wafer includes a vessel for holding an electroplating bath, a support for holding a semiconductor wafer within the vessel and beneath a surface of the bath; first and second electrodes within the vessel, between which an electrical current may flow causing conductive material to be electrolytically deposited onto the wafer, a third electrode disposed outside of the bath for applying a static electric charge to the wafer, and an electrical power supply coupled with the third electrode.


Find Patent Forward Citations

Chang, Chung-Liang. (2012). Apparatus for electrochemical plating semiconductor wafers (U.S. Patent No. 8277619). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8277619

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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