The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Mar. 05, 2007
Applicants:
Hiromasa Kato, Fujisawa, JP;
Takayuki Naba, Chigasaki, JP;
Noritaka Nakayama, Yokohama, JP;
Inventors:
Assignees:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Materials Co., Ltd., Yokohama-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic component modulehas a circuit boardin which metal platesandare bonded to both surfaces of a ceramic substrate, and an electronic componentthat is bonded to at least one surface of the metal plateand is operable at least 125° C. The electronic componentis bonded to the metal platevia a brazing material layerhaving a higher melting point than a operating temperature of the electronic component