The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Mar. 05, 2010
Tzyy-jang Tseng, Hsinchu, TW;
Chang-ming Lee, Taoyuan County, TW;
Wen-fang Liu, Taoyuan County, TW;
Cheng-po Yu, Taoyuan County, TW;
Tzyy-Jang Tseng, Hsinchu, TW;
Chang-Ming Lee, Taoyuan County, TW;
Wen-Fang Liu, Taoyuan County, TW;
Cheng-Po Yu, Taoyuan County, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A manufacturing method of a circuit substrate includes the following steps. A dielectric layer is formed on at least one surface of a substrate. An insulating layer is formed on the dielectric layer. A portion of the insulating layer and a portion of the dielectric layer are removed, so as to form at least one blind via in the dielectric layer and the insulating layer. An electroless plating layer is formed on the sidewall of the blind via and a remaining portion of the insulating layer, wherein the binding strength between the insulating layer and the electroless plating layer is greater than that between the dielectric layer and the electroless plating layer. A patterned conductive layer is plated to cover the electroless plating layer.