The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Apr. 13, 2009
Applicants:
Chunshan Yin, Singapore, SG;
Lee Wee Teo, Singapore, SG;
Chung Foong Tan, Singapore, SG;
Jae Gon Lee, Singapore, SG;
Inventors:
Chunshan Yin, Singapore, SG;
Lee Wee Teo, Singapore, SG;
Chung Foong Tan, Singapore, SG;
Jae Gon Lee, Singapore, SG;
Assignee:
GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/01 (2006.01); H01L 27/12 (2006.01); H01L 31/0392 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit system includes: providing a second layer between a first layer and a third layer; forming an active device over the third layer; forming the third layer to form an island region underneath the active device; forming the second layer to form a floating second layer with an undercut beneath the island region; and depositing a fourth layer around the island region and the floating second layer.