The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
Jan. 21, 2010
Griselda Bonilla, Hopewell Junction, NY (US);
Kaushik Chanda, Hopewell Junction, NY (US);
Ronald G. Filippi, Hopewell Junction, NY (US);
Stephan Grunow, Hopewell Junction, NY (US);
Chao-kun HU, Yorktown Heights, NY (US);
Naftali E. Lustig, Hopewell Junction, NY (US);
Andrew H. Simon, Hopewell Junction, NY (US);
Ping-chuan Wang, Hopewell Junction, NY (US);
Griselda Bonilla, Hopewell Junction, NY (US);
Kaushik Chanda, Hopewell Junction, NY (US);
Ronald G. Filippi, Hopewell Junction, NY (US);
Stephan Grunow, Hopewell Junction, NY (US);
Chao-Kun Hu, Yorktown Heights, NY (US);
Naftali E. Lustig, Hopewell Junction, NY (US);
Andrew H. Simon, Hopewell Junction, NY (US);
Ping-Chuan Wang, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An interconnect structure for an integrated circuit (IC) device includes a metal line formed within a dielectric layer, the metal line having one or more vertical diffusion barriers therein; wherein the one or more vertical diffusion barriers correspond to a liner material of a via formed above the metal line, with the via extending completely through a thickness of the metal line such that a bottom most portion of the via comprises a portion of the metal line.