The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
Nov. 09, 2009
Che-jung Chang, Taichung County, TW;
Chin-tien Chiu, Taichung, TW;
Cheeman Yu, Madison, WI (US);
Hem Takiar, Fremont, CA (US);
Jack Chang Chien, Kaoshiung, TW;
Ning Liu, Shenzhen, CN;
Che-Jung Chang, Taichung County, TW;
Chin-Tien Chiu, Taichung, TW;
Cheeman Yu, Madison, WI (US);
Hem Takiar, Fremont, CA (US);
Jack Chang Chien, Kaoshiung, TW;
Ning Liu, Shenzhen, CN;
SanDisk Technologies Inc., Plano, TX (US);
Abstract
A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.