The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2012

Filed:

Oct. 24, 2011
Applicants:

Kun Joo Park, Gyeonggi-do, KR;

Kwang Hoon Han, Gyeonggi-do, KR;

Kee Hyun Kim, Gyeonggi-do, KR;

Weon Mook Lee, Gyeonggi-do, KR;

Kyounghoon Han, Seoul, KR;

Heeyeop Chae, Gyeonggi-do, KR;

Inventors:

Kun Joo Park, Gyeonggi-do, KR;

Kwang Hoon Han, Gyeonggi-do, KR;

Kee Hyun Kim, Gyeonggi-do, KR;

Weon Mook Lee, Gyeonggi-do, KR;

Kyounghoon Han, Seoul, KR;

Heeyeop Chae, Gyeonggi-do, KR;

Assignee:

DMS Co. Ltd, Suwon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An endpoint detection device, a plasma reactor with the endpoint detection device, and an endpoint detection method are provided. The endpoint detection device includes an OES data operation unit, a data selector, a product generator, an SVM, and an endpoint determiner. The OES data operation unit processes reference OES data by normalization and PCA. The data selector selects part of the linear reference loading vectors and selects part of the selected linear reference loading vectors. The product generator outputs at least one reference product value. The SVM performs regression and outputs a prediction product value. The endpoint determiner detects a process wafer etch or deposition endpoint and outputs a detection signal.


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