The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Jul. 29, 2010
Yuji Watanabe, Tokyo, JP;
Hisashi Tanie, Ibaraki, JP;
Koji Hosokawa, Tokyo, JP;
Mitsuaki Katagiri, Tokyo, JP;
Ichiro Anjo, Tokyo, JP;
Yuji Watanabe, Tokyo, JP;
Hisashi Tanie, Ibaraki, JP;
Koji Hosokawa, Tokyo, JP;
Mitsuaki Katagiri, Tokyo, JP;
Ichiro Anjo, Tokyo, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
A BGA semiconductor device includes a semiconductor package and a mounting board mounting thereon the semiconductor package, wherein an array of signal electrodes of the semiconductor package and an array of signal electrodes of the mounting board are coupled together via signal bumps. The BGA semiconductor device also includes a dummy bump, which reinforces the bending strength of the BGA semiconductor device and is broken by a shearing force caused by thermal expansion to alleviate the stress for the signal bumps.