The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2012
Filed:
May. 26, 2011
Ru-gun Liu, Hsinchu, TW;
Chih-ming Lai, Hsinchu, TW;
Wen-chun Huang, Tainan County, TW;
Boren Luo, Hsinchu, TW;
I-chang Shin, Hsinchu, TW;
Yao-ching Ku, Hsinchu, TW;
Cliff Hou, Taipei, TW;
Ru-Gun Liu, Hsinchu, TW;
Chih-Ming Lai, Hsinchu, TW;
Wen-Chun Huang, Tainan County, TW;
Boren Luo, Hsinchu, TW;
I-Chang Shin, Hsinchu, TW;
Yao-Ching Ku, Hsinchu, TW;
Cliff Hou, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Methods and systems for providing processing parameters in a secure format are disclosed. In one aspect, a method for providing semiconductor fabrication processing parameters to a design facility is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a model from the set of processing parameters; converting the model into a corresponding set of kernels; converting the set of kernels into a corresponding set of matrices; and communicating the set of matrices to the design facility. In another aspect, a method for providing semiconductor fabrication processing parameters is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a processing model from the set of processing parameters; encrypting the processing model into a format for use with a plurality of EDA tools; and communicating the encrypted processing model format to a design facility.