The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2012
Filed:
Oct. 28, 2008
E. Todd Ryan, Wappingers Falls, NY (US);
Holger Schuehrer, Dresden, DE;
Seung-hyun Rhee, Fishkill, NY (US);
E. Todd Ryan, Wappingers Falls, NY (US);
Holger Schuehrer, Dresden, DE;
Seung-Hyun Rhee, Fishkill, NY (US);
Global Foundries, Inc., Grand Cayman, KY;
Abstract
A semiconductor package is provided having reduced tensile stress. The semiconductor package includes a package substrate and a semiconductor die. The semiconductor die is coupled electrically and physically to the package substrate and includes a stress relieving layer incorporated therein. The stress relieving layer has a predetermined structure and a predetermined location within the semiconductor die for reducing tensile stress of the semiconductor package during heating and cooling of the semiconductor package.