The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2012
Filed:
Apr. 29, 2010
Kuo-hsien Liao, Taichung, TW;
Jian-cheng Chen, Tainan County, TW;
Chen-chuan Fan, Tainan County, TW;
Chi-tsung Chiu, Kaohsiung, TW;
Chih-pin Hung, Koahsiung, TW;
Kuo-Hsien Liao, Taichung, TW;
Jian-Cheng Chen, Tainan County, TW;
Chen-Chuan Fan, Tainan County, TW;
Chi-Tsung Chiu, Kaohsiung, TW;
Chih-Pin Hung, Koahsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaosiung, TW;
Abstract
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a grounding element disposed adjacent to a periphery of a substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit. The grounding element includes an indented portion that is disposed adjacent to a lateral surface of the substrate unit. The semiconductor device package also includes an EMI shield that is electrically connected to the grounding element and is inwardly recessed adjacent to the indented portion of the grounding element.