The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2012

Filed:

Aug. 11, 2011
Applicants:

Phillip Francis Chapman, Essex Junction, VT (US);

David Goren, Haifa, IL;

Rajendran Krishnasamy, Essex Junction, VT (US);

Benny Sheinman, Haifa, IL;

Shlomo Shlafman, Haifa, IL;

Raminderpal Singh, Hopewell Junction, NY (US);

Wayne H. Woods, Essex Junction, VT (US);

Inventors:

Phillip Francis Chapman, Essex Junction, VT (US);

David Goren, Haifa, IL;

Rajendran Krishnasamy, Essex Junction, VT (US);

Benny Sheinman, Haifa, IL;

Shlomo Shlafman, Haifa, IL;

Raminderpal Singh, Hopewell Junction, NY (US);

Wayne H. Woods, Essex Junction, VT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/119 (2006.01); H01L 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A novel and useful apparatus for and method of providing noise isolation between integrated circuit devices on a semiconductor chip. The invention addresses the problem of noise generated by digital switching devices in an integrated circuit chip that may couple through the silicon substrate into sensitive analog circuits (e.g., PLLs, transceivers, ADCs, etc.) causing a significant degradation in performance of the sensitive analog circuits. The invention utilizes a deep trench capacitor (DTCAP) device connected to ground to isolate victim circuits from aggressor noise sources on the same integrated circuit chip. The deep penetration of the capacitor creates a grounded shield deep in the substrate as compared with other prior art shielding techniques.


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