The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2012

Filed:

Feb. 28, 2011
Applicants:

Larson D. Lindholm, Boise, ID (US);

David K. Hwang, Boise, ID (US);

Inventors:

Larson D. Lindholm, Boise, ID (US);

David K. Hwang, Boise, ID (US);

Assignee:

Micron Technologies, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 21/8242 (2006.01); H01L 21/336 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a vertical field effect transistor includes etching an opening into semiconductor material. Sidewalls and radially outermost portions of the opening base are lined with masking material. A semiconductive material pillar is epitaxially grown to within the opening adjacent the masking material from the semiconductor material at the opening base. At least some of the masking material is removed from the opening. A gate dielectric is formed radially about the pillar. Conductive gate material is formed radially about the gate dielectric. An upper portion of the pillar is formed to comprise one source/drain region of the vertical transistor. Semiconductive material of the pillar received below the upper portion is formed to comprise a channel region of the vertical transistor. Semiconductor material adjacent the opening is formed to comprise another source/drain region of the vertical transistor. Other aspects and implementations are contemplated.


Find Patent Forward Citations

Loading…