The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2012
Filed:
Apr. 20, 2011
Jeffrey Drue David, San Jose, CA (US);
Garrett Ho Yee Sin, Sunnyvale, CA (US);
Harry Q. Lee, Los Altos, CA (US);
Dominic J. Benvegnu, La Honda, CA (US);
Jeffrey Drue David, San Jose, CA (US);
Garrett Ho Yee Sin, Sunnyvale, CA (US);
Harry Q. Lee, Los Altos, CA (US);
Dominic J. Benvegnu, La Honda, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.