The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2012
Filed:
Mar. 16, 2009
Sumi Takamiya, Shizuoka-ken, JP;
Tadashi Inaba, Shizouka-ken, JP;
Atsushi Mizutani, Shizuoka-ken, JP;
Tomoo Kato, Shizuoka-ken, JP;
Toshiyuki Saie, Shizuoka-ken, JP;
Sumi Takamiya, Shizuoka-ken, JP;
Tadashi Inaba, Shizouka-ken, JP;
Atsushi Mizutani, Shizuoka-ken, JP;
Tomoo Kato, Shizuoka-ken, JP;
Toshiyuki Saie, Shizuoka-ken, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
The invention provides a metal polishing composition that is used in chemical mechanical polishing in production of a semiconductor device, and includes an oxidizing agent, an abrasive grain, and at least one compound selected from compounds represented by the following formula (I) and the following formula (II). The invention also provides a chemical mechanical polishing method that uses the metal polishing composition. In formula (I), Rrepresents a hydrogen atom or an alkyl group, and Ph represents a phenyl ring. In formula (II), Rrepresents a hydrogen atom or an alkyl group, and Ph represents a phenyl ring.