The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2012
Filed:
Nov. 12, 2010
Donna M. Alden, Bear, DE (US);
Andrew R. Wank, Avondale, PA (US);
Robert Gargione, Middletown, DE (US);
Mark E. Gazze, Lincoln University, PA (US);
Joseph K. SO, Wilmington, DE (US);
David Drop, West Grove, PA (US);
Shawn Riley, Wilmington, DE (US);
Mai Tieu Banh, Oakville, CA;
Donna M. Alden, Bear, DE (US);
Andrew R. Wank, Avondale, PA (US);
Robert Gargione, Middletown, DE (US);
Mark E. Gazze, Lincoln University, PA (US);
Joseph K. So, Wilmington, DE (US);
David Drop, West Grove, PA (US);
Shawn Riley, Wilmington, DE (US);
Mai Tieu Banh, Oakville, CA;
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Abstract
The method provides a method of preparing a silicate-containing polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. The method includes introducing a feed stream of gas-filled polymeric microelements into a gas jet. The polymeric microelements have varied densities, varied wall thickness and varied particle size. Passing the gas-filled microelements in the gas jet adjacent a Coanda block, the Coanda block having a curved wall for separates the polymeric microelements with Coanda effect, inertia and gas flow resistance. The coarse polymeric microelements from the curved wall of the Coanda block to clean the polymeric microelements. The polymeric microelements collected contain less than 0.1 weight percent total of the polymeric microelements being associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm. Inserting the cleaned polymeric microelements into a polymeric matrix forms the polishing pad.