The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Jul. 18, 2005
Applicants:
Chiu-ming Chou, Kao-hsiung, TW;
Chien-kang Chou, Tainan Hsien, TW;
Mou-shiung Lin, Hsin-Chu, TW;
Inventors:
Assignee:
Megica Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor chip or wafer includes a passivation layer, a pad and a bump. The pad is exposed by an opening in the passivation layer. The bump is connected to the pad, wherein the area of the connection between the pad and the bump is larger than 30,000 μm.