The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Nov. 23, 2007
Yoichiro Kawamura, Gifu, JP;
Shigeki Sawa, Gifu, JP;
Katsuhiko Tanno, Gifu, JP;
Hironori Tanaka, Gifu, JP;
Naoaki Fujii, Gifu, JP;
Yoichiro Kawamura, Gifu, JP;
Shigeki Sawa, Gifu, JP;
Katsuhiko Tanno, Gifu, JP;
Hironori Tanaka, Gifu, JP;
Naoaki Fujii, Gifu, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A method of manufacturing a printed wiring board includes preparing a wiring substrate having a conductive circuit, coating a solder-resist layer over the conductive circuit, leveling a surface of the solder-resist layer so as to obtain a maximum surface roughness in a predetermined range, removing the resin film from the surface of the solder-resist layer, and forming multiple openings in the surface of the solder-resist layer to expose multiple portions of the conductive circuit so as to form multiple conductive pads for mounting an electronic components.