The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Jul. 16, 2010
Applicants:
Masahiro Miyasaka, Hitachi, JP;
Takashi Kumaki, Hitachi, JP;
Inventors:
Masahiro Miyasaka, Hitachi, JP;
Takashi Kumaki, Hitachi, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/028 (2006.01);
U.S. Cl.
CPC ...
Abstract
A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a Calkoxy group or a Calkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
Miyasaka, Masahiro. (2012). Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board (U.S. Patent No. 8198008). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8198008
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile