The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Dec. 08, 2010
Hideki Soeda, Hitachinaka, JP;
Masayuki Ochi, Kamisato, JP;
Hideki Soeda, Hitachinaka, JP;
Masayuki Ochi, Kamisato, JP;
Hitachi High-Technologies Corporation, Tokyo, JP;
Abstract
An optical semiconductor wafer inspection system and a method thereof are provided for voids and particles produced in a flattening process by classifying and inspecting defects such as scratches, a polishing or grinding technique used for semiconductor manufacturing. The present invention is an optical semiconductor wafer inspection system and a method thereof characterized by obliquely illuminating a scratch, void or particle produced on the surface of a polished or ground insulating film at substantially the same velocity of light, detecting scattered light at the time of oblique illumination from the surface of an inspection target at different angles and thereby classifying the scratch, void or particle.