The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2012
Filed:
Aug. 25, 2008
Applicants:
Sotaro Ito, Gifu, JP;
Michimasa Takahashi, Gifu, JP;
Yukinobu Mikado, Gifu, JP;
Inventors:
Assignee:
Ibiden, Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multilayer wiring board includes a multilayer wiring substrate having a concave portion which accommodates an electronic component. The multilayer wiring substrate has multiple insulation layers, multiple conductive circuits, multiple vias and an electromagnetic shielding layer. The conductive circuits are separated by the insulation layers and electrically connected through the vias. The electromagnetic shielding layer has a roughened surface and formed along one of a bottom surface and side surfaces of the concave portion in the multilayer wiring substrate.