The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2012
Filed:
May. 24, 2007
Akihiko Nakamura, Kanagawa, JP;
Atsushi Miyanari, Kanagawa, JP;
Yoshihiro Inao, Kanagawa, JP;
Yasumasa Iwata, Kanagawa, JP;
Akihiko Nakamura, Kanagawa, JP;
Atsushi Miyanari, Kanagawa, JP;
Yoshihiro Inao, Kanagawa, JP;
Yasumasa Iwata, Kanagawa, JP;
Tokyo Ohka Kogyo Co., Ltd., , JP;
Abstract
A wafer can be thinned without occurrences of dimples. A support platehas a number of through holes. A circuit forming surface of a waferis adhered to one surface of the support plate by an adhesive member, and a dimple prevention memberhaving a thickness of 100 μm or more and having an adhesive layeron one face is adhered to the other surface, thus the openings at both ends of the through holesare blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.