The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
May. 20, 2010
Tzyy-jang Tseng, Hsinchu, TW;
Chang-ming Lee, Taoyuan County, TW;
Wen-fang Liu, Taoyuan County, TW;
Cheng-po Yu, Taoyuan County, TW;
Tzyy-Jang Tseng, Hsinchu, TW;
Chang-Ming Lee, Taoyuan County, TW;
Wen-Fang Liu, Taoyuan County, TW;
Cheng-Po Yu, Taoyuan County, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A manufacturing method of circuit structure is described as follows. Firstly, a composite dielectric layer, a circuit board and an insulating layer disposed therebetween are provided. The composite dielectric layer includes a non-platable dielectric layer and a platable dielectric layer between the non-platable dielectric layer and the insulating layer wherein the non-platable dielectric layer includes a chemical non-platable material and the platable dielectric layer includes a chemical platable material. Then, the composite dielectric layer, the circuit board and the insulating layer are compressed. Subsequently, a through hole passing through the composite dielectric layer and the insulating layer is formed and a conductive via connecting a circuit layer of the circuit board is formed therein. Then, a trench pattern passing through the non-platable dielectric layer is formed on the composite dielectric layer. Subsequently, a chemical plating process is performed to form a conductive pattern in the trench pattern.