The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2012

Filed:

Jan. 24, 2007
Applicants:

Koichi Sakamoto, Tsukui-gun, JP;

Yamato Tonegawa, Nirasaki, JP;

Takehiko Fujita, Nirasaki, JP;

Inventors:

Koichi Sakamoto, Tsukui-gun, JP;

Yamato Tonegawa, Nirasaki, JP;

Takehiko Fujita, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor process system () includes a measuring section (), an information processing section (), and a control section (). The measuring section () measures a characteristic of a test target film formed on a target substrate (W) by a semiconductor process. The information processing section () calculates a positional correction amount of the target substrate (W) necessary for improving planar uniformity of the characteristic, based on values of the characteristic measured by the measuring section () at a plurality of positions on the test target film. The control section () controls a drive section (A,A) of a transfer device (), based on the positional correction amount, when the transfer device () transfers a next target substrate (W) to the support member () to perform the semiconductor process.


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