The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2012
Filed:
Mar. 04, 2009
Applicants:
Shigeharu Arisa, Tokyo, JP;
Toshiyuki Ozawa, Tokyo, JP;
Inventors:
Shigeharu Arisa, Tokyo, JP;
Toshiyuki Ozawa, Tokyo, JP;
Assignee:
Tokyo Seimitsu Co., Ltd., Mitaka-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24B 49/00 (2012.01);
U.S. Cl.
CPC ...
Abstract
A wafer grinding method and a wafer grinding machine are disclosed for grinding a wafer by executing both the rough grinding process and the finish grinding process. After the rough grinding process before the finish grinding process, the wafer thickness is measured with a noncontact-type thickness gauge, and during the finish grinding process, the finish thickness is finely adjusted by use of a contact-type thickness gauge and referring to the measurement data of the noncontact-type thickness gauge.