The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2012

Filed:

Sep. 30, 2010
Applicants:

Hans-joachim Barth, Munich, DE;

Gottfried Beer, Nittendorf, DE;

Joern Plagmann, Munich, DE;

Jens Pohl, Bernhardswald, DE;

Werner Robl, Regensburg, DE;

Rainer Steiner, Regensburg, DE;

Mathias Vaupel, Regensburg, DE;

Inventors:

Hans-Joachim Barth, Munich, DE;

Gottfried Beer, Nittendorf, DE;

Joern Plagmann, Munich, DE;

Jens Pohl, Bernhardswald, DE;

Werner Robl, Regensburg, DE;

Rainer Steiner, Regensburg, DE;

Mathias Vaupel, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/4763 (2006.01); H01L 21/469 (2006.01);
U.S. Cl.
CPC ...
Abstract

One or more embodiments relate to a method of forming an electronic device, comprising: providing a workpiece; forming a first barrier layer over the workpiece; forming an intermediate conductive layer over the first barrier layer; forming a second barrier layer over the intermediate conductive layer; forming a seed layer over the second barrier layer; removing a portion of the seed layer to leave a remaining portion of the seed layer and to expose a portion of the second barrier layer; and electroplating a fill layer on the remaining portion of the seed layer.


Find Patent Forward Citations

Loading…