The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
Nov. 24, 2008
Syota Miki, Nagano, JP;
Tadashi Arai, Nagano, JP;
Syota Miki, Nagano, JP;
Tadashi Arai, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
An electronic component mounting package includes a structure (coreless substrate) in which a plurality of wiring layers are stacked one on top of another with insulating layers interposed therebetween and are interconnected through via holes formed in the insulating layers. The entire surface of the coreless substrate, exclusive of pad portions defined at desired positions of the outermost wiring layers thereof, is covered with a molding resin. Further, an interposer is mounted on the side of the electronic component mounting surface of the coreless substrate, and the molding resin is partially filled into a gap between the coreless substrate and the interposer.