The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2012

Filed:

Mar. 21, 2011
Applicants:

Young DO Kweon, Boise, ID (US);

J. Michael Brooks, Caldwell, ID (US);

Tongbi Jiang, Boise, ID (US);

Inventors:

Young Do Kweon, Boise, ID (US);

J. Michael Brooks, Caldwell, ID (US);

Tongbi Jiang, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Microelectronic devices and methods for manufacturing microelectronic devices are described herein. An embodiment of one such method includes attaching a plurality of singulated microelectronic dies to a removable support member with an active side of the individual dies facing toward the support member, depositing a flowable material onto the dies and a portion of the removable support member such that the flowable material covers a back side of the individual dies and is disposed between adjacent dies, and removing the support member from the active sides of the dies.


Find Patent Forward Citations

Loading…