The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Jul. 08, 2010
Michio Horiuchi, Nagano, JP;
Yasue Tokutake, Nagano, JP;
Yuichi Matsuda, Nagano, JP;
Tomoo Yamasaki, Nagano, JP;
Yuta Sakaguchi, Nagano, JP;
Michio Horiuchi, Nagano, JP;
Yasue Tokutake, Nagano, JP;
Yuichi Matsuda, Nagano, JP;
Tomoo Yamasaki, Nagano, JP;
Yuta Sakaguchi, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
In a semiconductor device, a substrate includes a plurality of line conductors which penetrate the substrate from a top surface to a bottom surface of the substrate. A semiconductor chip is secured in a hole of the substrate. A first insulating layer is formed on the top surfaces of the substrate and the semiconductor chip. A first wiring layer is formed on the first insulating layer and electrically connected via through holes of the first insulating layer to the semiconductor chip and some line conductors exposed to one of the through holes. A second insulating layer is formed on the bottom surfaces of the substrate and the semiconductor chip. A second wiring layer is formed on the second insulating layer and electrically connected via a through hole of the second insulating layer to some line conductors exposed to the through hole.