The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Nov. 25, 2009
Maxim Kelman, Mountain View, CA (US);
Michael Burrows, Cupertino, CA (US);
Dmitry Poplavskyy, San Jose, CA (US);
Giuseppe Scardera, Sunnyvale, CA (US);
Daniel Kray, Freiburg, DE;
Elena Rogojina, Los Altos, CA (US);
Maxim Kelman, Mountain View, CA (US);
Michael Burrows, Cupertino, CA (US);
Dmitry Poplavskyy, San Jose, CA (US);
Giuseppe Scardera, Sunnyvale, CA (US);
Daniel Kray, Freiburg, DE;
Elena Rogojina, Los Altos, CA (US);
Innovalight, Inc., Sunnyvale, CA (US);
Abstract
A method of forming a multi-doped junction is disclosed. The method includes providing a first substrate and a second substrate. The method also includes depositing a first ink on a first surface of each of the first substrate and the second substrate, the first ink containing a first set of nanoparticles and a first set of solvents, the first set of nanoparticles containing a first concentration of a first dopant. The method further includes depositing a second ink on a second surface of each of the first substrate and the second substrate, the second ink containing a second set of nanoparticles and a second set of solvents, the second set of nanoparticles containing a second concentration of a second dopant. The method also includes placing the first substrate and the second substrate in a back to back configuration; and heating the first substrate and the second substrate in a first drive-in ambient to a first temperature and for a first time period. The method further includes exposing the first substrate and the second substrate in the back to back configuration to a deposition ambient, the deposition ambient containing POCl, a carrier Ngas, a main Ngas, and a reactive Ogas for a second time period; and heating the first substrate and the second substrate in a second drive-in ambient to a third temperature for a third time period.