The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Dec. 31, 2008
Fu-tien Weng, Shin Chu, TW;
Yu-kung Hsiao, Yang Mei Town, TW;
Hung-jen Hsu, Taoyuan, TW;
Yi-ming Dai, Hsin-Chu, TW;
Chin Chen Kuo, Taipei, TW;
Te-fu Tseng, Hsin-Chu, TW;
Chih-kung Chang, Hsin-Chu, TW;
Jack Deng, Jhunan Township, TW;
Chung-sheng Hsiung, Zhudong Town, TW;
Bii-junq Chang, Hsin-Chu, TW;
Fu-Tien Weng, Shin Chu, TW;
Yu-Kung Hsiao, Yang Mei Town, TW;
Hung-Jen Hsu, Taoyuan, TW;
Yi-Ming Dai, Hsin-Chu, TW;
Chin Chen Kuo, Taipei, TW;
Te-Fu Tseng, Hsin-Chu, TW;
Chih-Kung Chang, Hsin-Chu, TW;
Jack Deng, Jhunan Township, TW;
Chung-Sheng Hsiung, Zhudong Town, TW;
Bii-Junq Chang, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.