The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2012

Filed:

Apr. 11, 2007
Applicants:

Hajime Nakamura, Chigasaki, JP;

Mayako Taniguchi, Chigasaki, JP;

Koji Ishino, Chigasaki, JP;

Takaaki Shindou, Chigasaki, JP;

Junichirou Tsutsui, Chigasaki, JP;

Yukio Kikuchi, Chigasaki, JP;

Kazuya Saitou, Chigasaki, JP;

Inventors:

Hajime Nakamura, Chigasaki, JP;

Mayako Taniguchi, Chigasaki, JP;

Koji Ishino, Chigasaki, JP;

Takaaki Shindou, Chigasaki, JP;

Junichirou Tsutsui, Chigasaki, JP;

Yukio Kikuchi, Chigasaki, JP;

Kazuya Saitou, Chigasaki, JP;

Assignee:

Ulvac, Inc., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a vertical substrate transfer apparatus and a film-forming apparatus capable of, regardless of a carrying position of a substrate, subjecting either surface thereof to film-formation, and capable of supporting and carrying the substrate without interfering with a non-film-forming surface. A film-forming apparatus () according to the present invention includes a carrier () giving support so that either surface of a substrate (W) is processable, a first position changing section () changing a carrying position of the carrier (), and a carrying chamber () housing the carrier, whose position is changed therein and which carries the carrier to a film-forming chamber (). With the above construction, it becomes possible to subject either surface to film-forming processing regardless of the carrying position of the substrate (W). Further, it becomes possible to change a film-forming surface (Wa) in the course of carrying the substrate (W). Furthermore, it becomes possible to support the substrate (W) without causing the carrier () to interfere with a non-film-forming surface of the substrate (W).


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