The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2012

Filed:

Jan. 28, 2009
Applicants:

Masayuki Motonari, Yokkaichi, JP;

Tomikazu Ueno, Yokkaichi, JP;

Masahiro Yamamoto, Tuchiura, JP;

Yuugo Tai, Yokkaichi, JP;

Hiroyuki Miyauchi, Yokkaichi, JP;

Inventors:

Masayuki Motonari, Yokkaichi, JP;

Tomikazu Ueno, Yokkaichi, JP;

Masahiro Yamamoto, Tuchiura, JP;

Yuugo Tai, Yokkaichi, JP;

Hiroyuki Miyauchi, Yokkaichi, JP;

Assignee:

JSR Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chemical mechanical polishing pad used for chemical mechanical polishing comprises a polishing surface, a non-polishing surface that is provided opposite to the polishing surface, a side surface that connects an outer edge of the polishing surface and an outer edge of the non-polishing surface, and a plurality of grooves formed in the polishing surface. The side surface has a slope surface that is connected to the polishing surface, and a depth of the grooves is equal to or smaller than a height of the slope surface.


Find Patent Forward Citations

Loading…