The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Aug. 09, 2007
Yoshinori Hayashi, Yokohama, JP;
Takeki Kogawa, Yokohama, JP;
Hideki Mori, Yokohama, JP;
Akimasa Hori, Yokohama, JP;
Yoshinori Hayashi, Yokohama, JP;
Takeki Kogawa, Yokohama, JP;
Hideki Mori, Yokohama, JP;
Akimasa Hori, Yokohama, JP;
Shibaura Mechatronics Corporation, Yokohama-shi, JP;
Abstract
An inspecting device and an inspecting method enabling better precision inspection for a processing region formed on a surface of a semiconductor wafer or other disc wafer are provided. The inspecting device is configured having image capturing meansfor capturing an image of an outer edge and its neighboring region of a rotating wafer, wafer outer edge position measuring meansfor measuring the radial direction position of the outer edge at each of the plurality of rotational angle positions θn of the waferbased on the images obtained by the image capturing means, an edge-to-edge distance measuring meansfor measuring the edge-to-edge distance Bbetween the outer edge of the waferand the edge of an insulating filmat each of the plurality of rotational angle positions θn based on the images obtained by the image capturing means, and an inspection information generating meansfor generating predetermined inspection information based on the radial direction position Aof the outer edge of the waferand the edge-to-edge distance B.