The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Jul. 01, 2005
Applicants:
Seishi Murakami, Nirasaki, JP;
Kunihiro Tada, Nirasaki, JP;
Inventors:
Seishi Murakami, Nirasaki, JP;
Kunihiro Tada, Nirasaki, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01);
U.S. Cl.
CPC ...
Abstract
A processing apparatus has a placement stage that prevents generation of a crack due to heating of an embedded heater. The placement stage (A) on which a wafer (W) is placed has a plurality of areas (Aa,Ab) so that one of the plurality of heaters is embedded independently in each of the plurality of areas. The heater (Aa) embedded in one area (Aa) of adjacent areas has a part (Aa) extending in the other area (Ab) of the adjacent areas, and the heater (Ab) embedded in the other area (Ab) of the adjacent areas has a part (Ab) extending in the one area (Aa).