The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2012
Filed:
Feb. 27, 2003
Kiyoshi Takekoshi, Nirasaki, JP;
Kiyoshi Takekoshi, Nirasaki, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
A dicing method, integrated circuit chip testing method, substrate holding apparatus, and adhesive film are disclosed. A first adhesive filmin which the adhesion is reduced by ultraviolet radiation is stretched inside a ring-like framelarger than a wafer size, and a wafer W is adhered on the first adhesion film. A second adhesive filmin which the adhesion of the two surfaces is reduced by heating is adhered on a plate-like jig. After the first film is adhered on the second film, dicing is performed. Since the wafer is adhered to the jig, the relative positions of chips do not shift from each other. This makes it possible to load the wafer together with the jig into a testing apparatus and align electrode pads of the chips with a probe. This allows, e.g., collective testing of a plurality of chips.