The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Mar. 05, 2009
Applicants:
Chia-sheng Lin, Taoyuan County, TW;
Yu-ting Huang, Taoyuan County, TW;
Chih-lung Lai, Taipei County, TW;
Inventors:
Chia-Sheng Lin, Taoyuan County, TW;
Yu-Ting Huang, Taoyuan County, TW;
Chih-Lung Lai, Taipei County, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
Embodiments provide an electronic device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick.
Lin, Chia-Sheng. (2012). Electronics device package and fabrication method thereof (U.S. Patent No. 8097929). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8097929
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile