The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Dec. 08, 2008
Weilin Gao, Iwata, JP;
Hisashi Suda, Iwata, JP;
Hiroto Narieda, Hamamatsu, JP;
Akira Sugawara, Iwata, JP;
Weilin Gao, Iwata, JP;
Hisashi Suda, Iwata, JP;
Hiroto Narieda, Hamamatsu, JP;
Akira Sugawara, Iwata, JP;
Dowa Metaltech Co., Ltd., Tokyo, JP;
Abstract
Provided is a Cu—Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent sprig-back resistance. The copper alloy sheet material has a composition containing, by mass, from 1.0 to 5.0% of Ti, and optionally containing at least one of at most 0.5% of Fe, at most 1.0% of Co and at most 1.5% of Ni, and further optionally containing at least one of Sn, Zn, Mg, Zr, Al, Si, P, B, Cr, Mn and V in an amount within a suitable range, with the balance of Cu and inevitable impurities, and having a crystal orientation satisfying the following expression (1) and preferably also satisfying the following expression (2). The mean crystal grain size of the material is controlled to be from 10 to 60 μm.{420}/{420}>1.0  (1){220}/{220}≦3.0  (2)