The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2012
Filed:
Nov. 17, 2008
Gwang Ho Kim, Namyangju-si, KR;
Jin Seong Kim, Mapo-gu, KR;
Dong Joo Park, Gangseo-gu, KR;
Dae Byoung Kang, Hwaseong-si, KR;
Gwang Ho Kim, Namyangju-si, KR;
Jin Seong Kim, Mapo-gu, KR;
Dong Joo Park, Gangseo-gu, KR;
Dae Byoung Kang, Hwaseong-si, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads are provided in two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body.