The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2011

Filed:

Feb. 19, 2009
Applicants:

Rainer Steiner, Regensburg, DE;

Jens Pohl, Bernhardswald, DE;

Werner Robl, Regensburg, DE;

Markus Brunnbauer, Lappersdorf, DE;

Gottfried Beer, Nittendorf, DE;

Inventors:

Rainer Steiner, Regensburg, DE;

Jens Pohl, Bernhardswald, DE;

Werner Robl, Regensburg, DE;

Markus Brunnbauer, Lappersdorf, DE;

Gottfried Beer, Nittendorf, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a chip comprising a contact element, a structured dielectric layer over the chip, and a conductive element coupled to the contact element. The conductive element comprises a first portion embedded in the structured dielectric layer, a second portion at least partially spaced apart from the first portion and embedded in the structured dielectric layer, and a third portion contacting a top of the structured dielectric layer and extending at least vertically over the first portion and the second portion.


Find Patent Forward Citations

Loading…