The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
Nov. 13, 2009
Applicants:
Vermal Raja Manikam, Shah Alam, MY;
Boon Yew Low, Petaling Jaya, MY;
Vittal Raja Manikam, Shah Alam, MY;
Inventors:
Vermal Raja Manikam, Shah Alam, MY;
Boon Yew Low, Petaling Jaya, MY;
Vittal Raja Manikam, Shah Alam, MY;
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29B 7/10 (2006.01); B29B 7/26 (2006.01); B01F 13/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for encapsulating a substrate includes placing a hardened encapsulant material in a container. The encapsulant material is then heated and stirred until it is in a liquid or gel state. The liquid encapsulant material is held in the container in a vacuum state and dispensed over semiconductor dies along a guide, which allows the liquid encapsulant material to cool slightly before it covers a die.