The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2011
Filed:
Nov. 14, 2008
Applicants:
Kyoko Miyata, Tokyo, JP;
Fumiki Aiso, Tokyo, JP;
Inventors:
Kyoko Miyata, Tokyo, JP;
Fumiki Aiso, Tokyo, JP;
Assignee:
Elpida Memory, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/335 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming a semiconductor device is provided, which may include, but is not limited to, the following processes. Grooves may be formed in an insulating region and in a semiconductor region, while forming burrs near the boundary between the insulating region and the semiconductor region. Protection films may be selectively formed on inside walls of the grooves except on bottom walls of the grooves. A selective thermal process may be carried out in the presence of the protection films, thereby removing the burrs.