The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Apr. 07, 2006
Eladio Clemente Delgado, Burnt Hills, NY (US);
Richard Alfred Beaupre, Pittsfield, MA (US);
Stephen Daley Arthur, Glenville, NY (US);
Ernest Wayne Balch, Ballston Spa, NY (US);
Kevin Matthew Durocher, Waterford, NY (US);
Paul Alan Mcconnelee, Schenectady, NY (US);
Raymond Albert Fillion, Niskayuna, NY (US);
Eladio Clemente Delgado, Burnt Hills, NY (US);
Richard Alfred Beaupre, Pittsfield, MA (US);
Stephen Daley Arthur, Glenville, NY (US);
Ernest Wayne Balch, Ballston Spa, NY (US);
Kevin Matthew Durocher, Waterford, NY (US);
Paul Alan McConnelee, Schenectady, NY (US);
Raymond Albert Fillion, Niskayuna, NY (US);
General Electric Company, Niskayuna, NY (US);
Abstract
A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.