Holographic condition assessment system for a structure including a semiconductor material

Abstract

An improved condition testing system and method integrated into microelectronic circuits includes a structure including a semiconductor material with a target portion and a second portion for determining the presence and nature of various external (e.g. magnetic field, microwave, bioelectric or incident radiation) or internal stresses (e.g. binary circuit-state or analog signal recognition) or conditions acting upon the material. The target portion has a first feature when at least one of the following occurs: an external force is received by the second portion of the structure and an internal condition occurs in the target portion. The system and method further has a test grating determined and shaped and located to produce a first optical interference pattern when the target portion and the grating are exposed to non-invasive illumination and when the target portion has the first feature. Further implementations use one or more diffraction structures, holograms, or holographic optical elements spaced apart from the circuit or electronic device under test to non-invasively optically test in parallel two or more targeted conditions having a shape, size, structure, intensity or orientation of the stress acting upon the material.