The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Mar. 30, 2007
Applicants:
Yaojian Lin, Singapore, SG;
Haijing Cao, Singapore, SG;
Qing Zhang, Singapore, SG;
Inventors:
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system is provided including providing an integrated circuit die having a contact pad, forming a protection cover over the contact pad, forming a passivation layer having a first opening over the protection cover with the first opening exposing the protection cover, developing a conductive layer over the passivation layer, and forming a pad opening in the protection cover for exposing the contact pad.
Quick Actions:
Lin, Yaojian. (2011). Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof (U.S. Patent No. 8026593). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8026593
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile