The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Dec. 22, 2008
Applicants:
Shih-cheng Chang, Hsin-Chu, TW;
Hsin-yu Pan, Taipei, TW;
Inventors:
Shih-Cheng Chang, Hsin-Chu, TW;
Hsin-Yu Pan, Taipei, TW;
Assignee:
Taiwan Semiconductor Manufactuirng Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/30 (2006.01); H01L 23/38 (2006.01); H01L 35/16 (2006.01); H01L 35/26 (2006.01); H01L 23/373 (2006.01); H01L 29/06 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
Abstract
A thermoelectric structure for cooling an integrated circuit (IC) chip comprises a first type superlattice layer formed on top of the IC chip connected to a first voltage, and a second type superlattice layer formed on the bottom of the IC chip connected to a second voltage, the second voltage being different from the first voltage, wherein an power supply current flows through the first and second type superlattice layer for cooling the IC chip.